Fan-Out Wafer-Level Packaging

Name: Fan-Out Wafer-Level Packaging
Brand: Springer Verlag, Singapore
SKU: 9789811088834
Price: 104.49 GBP
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9789811088834 Hardback

13 April 2018

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9789811088834 Fan-Out Wafer-Level Packaging

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This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. Fan-Out Wafer-Level Packaging

READERSHIP: General (US: Trade)

ISBN-10: 9811088837
ISBN-13: 9789811088834
Author: Lau, John H. /
Publisher: Springer Verlag, Singapore
Publication date: April 2018
Format: Hardback
Language: English
Dimensions: 241 x 170 x 27 mm
Weight: 660 g Pages: 303 pages, 150 Tables, color; 226 Illustrations, color; 52 Illustrations, black and white; XX, 303 p pages
Title: Fan-Out Wafer-Level Packaging

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