BULK ORDERS / PAYMENT ON INVOICE - Contact Us CONTACT US 0203 5190705

Fan-Out Wafer-Level Packaging


9789811088834 Fan-Out Wafer-Level Packaging
WORLDWIDE SHIPPING AND BULK DISCOUNTS
GET A QUOTE

 Our Price Only 
£104.49

incl. VAT



Quantity:
 


Checkout With Paypal



Local Depot: 2 IN STOCK
More Available: YES
Condition: Brand New
UK Delivery:1-3 working days
International Delivery:vary by country
Range: S
Discounts: Request Quote
Payment On Invoice: Schools, Teachers
UK Shipping: FREE £25+, £2.70/order
International Shipping: per kg

Bestseller Recommended




This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. Fan-Out Wafer-Level Packaging

READERSHIP: General (US: Trade)


ISBN-10: 9811088837
ISBN-13: 9789811088834
Author: Lau, John H. /
Publisher: Springer Verlag, Singapore
Publication date: April 2018
Format: Hardback
Language: English
Dimensions: 241 x 170 x 27 mm
Weight: 660 g Pages: 303 pages, 150 Tables, color; 226 Illustrations, color; 52 Illustrations, black and white; XX, 303 p pages
Title: Fan-Out Wafer-Level Packaging










Categories | Testimonials | About | Contact



Twitter Twits From SchoolDepot Facebook Posts From SchoolDepot LinkedIn Profile Google Plus Page