This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
Fan-Out Wafer-Level PackagingREADERSHIP: General (US: Trade)
ISBN-10: 9811088837
ISBN-13: 9789811088834
Author:
Lau, John H. /
Publisher: Springer Verlag, Singapore
Publication date: April 2018
Format: Hardback
Language: English
Dimensions: 241 x 170 x 27 mm
Weight: 660 g
Pages: 303 pages, 150 Tables, color; 226 Illustrations, color; 52 Illustrations, black and white; XX, 303 p pages
Title: Fan-Out Wafer-Level Packaging